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What practical uses does the encapsulation vacuum defoaming and solidification assembly line have in
source：m.xabgcl.cn | Release time：2025年09月09日1.Chip Scale Package
Flip Chip Packaging: In flip chip packaging, bottom filling adhesive is required to enhance the connection strength and reliability between the chip and the substrate. The vacuum defoaming and curing assembly line for sealing can first perform vacuum defoaming treatment on the bottom filling adhesive to remove bubbles in the adhesive, then accurately seal the adhesive solution into the gap between the chip and the substrate, and finally fully cure the adhesive through the curing process to form a firm connection, effectively dispersing the stress generated during chip operation and improving the service life of the chip.
Chip level packaging (CSP): CSP packages have smaller chip sizes and require high precision and quality in the encapsulation process. The assembly line can achieve precise control of adhesive volume and uniform sealing. Vacuum defoaming can ensure the density and uniformity of the sealing material, avoiding the influence of bubbles on chip performance. The curing process can quickly shape the packaging material, protect the chip from external environmental influences, and not affect the electrical performance of the chip.
2.Power semiconductor module packaging
Insulated Gate Bipolar Transistor (IGBT): IGBT modules generate a large amount of heat during operation and require encapsulation with good thermal conductivity and insulation properties. The vacuum defoaming and solidification assembly line for encapsulation can first vacuum defoam the thermal conductive encapsulation adhesive to ensure that there are no bubbles in the adhesive solution, thereby improving the thermal conductivity efficiency. Then, the adhesive solution is evenly encapsulated between the chip, pins, and substrate of the IGBT module, and after solidification, it forms a whole, effectively conducting heat out while isolating external water vapor, dust, etc., protecting the internal structure of the IGBT module, and improving its working stability in harsh environments such as high temperature and high humidity.
Metal oxide semiconductor field-effect transistor (MOSFET): The key parts of MOSFET devices, such as the source, drain, and gate, need to be well protected to prevent electrical short circuits and performance degradation. The vacuum defoaming and solidification assembly line for sealing ensures that the MOSFET chip and its pins are completely encapsulated in the sealing material through precise sealing. Vacuum defoaming ensures a tight fit between the sealing material and the chip surface, forming a strong protective layer after curing, and improving the electrical insulation performance and mechanical shock resistance of MOSFET devices.
3.Integrated Circuit Packaging
System in Package (SiP): SiP packaging integrates multiple chips and other electronic components into a single package, forming a complete system. The vacuum defoaming and curing assembly line can perform overall sealing of various chips, passive components, etc. in SiP packaging. Vacuum defoaming ensures that the sealing material is filled into every corner of the packaging body, eliminating gaps and bubbles. After curing, the entire packaging body has good mechanical strength and electrical performance, improving the reliability and stability of SiP packaging.
Multi Chip Module (MCM): The MCM package contains multiple chips that communicate with each other through wiring and interconnect structures. The vacuum degassing and solidification assembly line can perform encapsulation treatment on MCM packaging. Vacuum degassing can prevent the formation of bubbles in the encapsulation material during the filling process, thereby preventing damage to the interconnect structure between chips caused by bubbles. The encapsulation layer formed after solidification can protect the chips and interconnect structure from external environmental influences, improving the electrical performance and reliability of MCM packaging.
4.Sensor chip packaging
Micro Electro Mechanical Systems (MEMS) sensors: The structure of MEMS sensors is very small and complex, and the requirements for encapsulation processes are extremely strict. The vacuum defoaming and solidification assembly line for sealing can accurately control the amount and speed of sealing adhesive. Vacuum defoaming can control the bubble content in the adhesive solution at an extremely low level, avoiding the influence of bubbles on the microstructure and performance of MEMS sensors. The solidified sealing layer can protect the microstructure of MEMS sensors from external mechanical impact, chemical corrosion, and temperature changes, while not affecting the signal transmission and detection accuracy of the sensor.
Optical sensors: Optical sensors have high requirements for the transmission and detection accuracy of light, and the quality and performance of the encapsulation material directly affect the performance of the sensor. The sealing vacuum defoaming and solidification assembly line ensures good transparency and uniformity of the sealing material through vacuum defoaming treatment, avoiding interference of bubbles on light transmission. The sealing layer formed after solidification can protect the optical components and sensitive parts of the optical sensor, prevent pollution and damage caused by dust, water vapor, etc., and improve the stability and reliability of the optical sensor.
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